ISSN:2321-6212

Reach Us +44-1625-708989
All submissions of the EM system will be redirected to Online Manuscript Submission System. Authors are requested to submit articles directly to Online Manuscript Submission System of respective journal.

Joining of SiCf/SiC using preceramic polymers


13th International Conference on Advanced Materials and Nanotechnology

OCTOBER 26-28, 2017 OSAKA, JAPAN

Dong Hyuk Jeong, Pipit Fitriani, Amit S Sharma and Dang-Hyok Yoon

Yeungnam University, Republic of Korea

ScientificTracks Abstracts: Res. Rev. J Mat. Sci

DOI: 10.4172/2321-6212-C1-008

Abstract

SiCf/SiC possesses great potential for applications in severe conditions, including high temperatures and structural components for future fusion reactors. Various fabrication techniques have been developed to fabricate SiCf/SiC, which generally produce simple shape, such as plates and tubes. However, their practical utility can only be realized by integrating simple shapes into complex geometries. Therefore, considerable research efforts are being directed to develop filler materials, which can be employed to join SiCf/SiC. However, SiC-based fillers being similar to the SiCf/SiC joining body are a natural choice to preserve the outstanding properties of SiCf/SiC. Taking this into consideration, we tried to obtain pure SiC joining filler by pyrolyzing the preceramic polymers, such as Polycarbosilane (PCS) and Polysilazane (PSZ). Both of PCS and PSZ were applied in a paste form followed by thermal treatment, where SiC was the main products along with the presence of small amount of Si3N4, depending on the starting material. Because cracks and pores might be generated by the vaporization of gaseous products, which can hamper the overall joining properties, careful optimization for the polymeric composition, choice of filler, heating rate, joining temperature and pressure was performed. A slow heating rate of 2 °C/min was employed for the temperatures of 1600-1700 °C to obtain sound and crack-free joints, while the pressure of 3.5 and 20 MPa was applied. The joining strength was estimated by 3-point bending test and correlated with the interfacial microstructure, mode of failure as well as the joint thickness.

Biography

Dong Hyuk Jeong is pursuing his graduation from the School of Materials Science and Engineering at Yeungnam University, Republic of Korea. His current research is on the joining of SiCf/SiC for high temperature and nuclear reactor applications.