10 / 42
Page 120
conferenceseries
.com
Volume 6
Research & Reviews: Journal of Material Sciences
ISSN: 2321-6212
Advanced Materials 2018
September 04-06, 2018
September 04-06, 2018 | Zürich, Switzerland
21
st
International Conference on
Advanced Materials & Nanotechnology
Surface texturing with slanted silicon nano pillars to reduce its optical reflectivity
Jun-Hyun Kim
and
Chang-Koo Kim
Ajou University, South Korea
A
ntireflective surfaces are useful in many applications such as solar cells, light emitting diodes and optical lens systems.
Coating anti reflection layers is one of the ways to improve light trapping and decrease the optical reflectivity from the
surface. By controlling the refractive index of the coating layer, the destructive interference of light minimizes the reflection.
However, the use of hetero materials can limit the thermal stability and eventually the long-term reliability. The surface
texturing is another way of producing antireflective surfaces. Surfaces with silicon pillars in various shapes have been shown
to exhibit low reflectivity compared with bare surfaces. These pillars are mostly vertical. If the pillars are tilted from the surface
normal, more light would be trapped between the pillars. This would result in lower reflectivity of the surfaces. The surface can
be textured through either wet or dry etching. Wet chemical etching is very simple to operate, but only crystalline substrates
can be used to obtain slanted structures in wet chemical etching. Dry etching using gaseous plasmas offers high aspect ratio
structures due to its anisotropic etching characteristics. In a conventional plasma etching process, a sheath is formed along the
surface of a substrate, irrespective of its angle. Therefore, simply tilting of a sample is not adequate for obtaining slanted etch
profiles during conventional plasma etching. In this study, slanted silicon pillars at arbitrary angles were fabricated using the
slanted plasma etching technique. Optical analysis of surfaces with silicon pillars was made to investigate their antireflection
properties. It was shown that the reflectance of the surface with Si pillars was affected by the aspect ratio as well as the opening
area of the pillars.
Recent Publications
1. Jun-Hyun Kim, Jeong Geun Bak, Kangtaek Lee and Chang-Koo Kim (2018) Control of the electrical resistivity of Ni-Cr
wires using low pressure chemical vapor deposition of tin. Applied Surface Science 429:134-137.
2. Jun-Hyun Kim, Sung-Woon Cho and Chang-Koo Kim (2017) Angular dependence of Si
3
N
4
etching in C
4
F
6
/CH
2
F
2
/O
2
/
Ar plasmas. Chemical Engineering and Technology 40(12):2251-2256.
3. Jun-Hyun Kim, Sung-Woon Cho, Chang Jin Park, Heeyeop Chae and Chang-Koo Kim (2017) Angular dependences of
SiO
2
etch rates at different bias voltages in CF
4
, C
2
F
6
, and C
4
F
8
plasmas. Thin Solid Films 637:43-48.
4. Sung-Woon Cho, Jun-Hyun Kim, Hae-Min Lee, Heeyeop Chae and Chang-Koo Kim (2016) Super hydrophobic Si
surfaces having microscale rod structures prepared in a plasma etching system. Surface and Coatings Technology 306:82-
86.
5. Jun-Hyun Kim, Sung-Woon Cho, Doo Won Kang, Kyung Mi Lee, Chang Yong Baek, Hae-Min Lee and Chang-Koo Kim
(2016) Electrical, structural, and morphological characteristics of dopantless tin oxide films prepared by low pressure
chemical vapor deposition. Science of Advanced Materials 8(1):117-121.
Biography
Jun-Hyun Kim has completed his BS and MS degrees in Chemical Engineering at Ajou University, Suwon, South Korea in 2011 and 2013 respectively. He is
currently a PhD candidate in Chemical Engineering at Ajou University. He has expertise in Plasma Processing, especially Plasma Etching.
kairi0401@ajou.ac.krJun-Hyun Kim et al., Res. Rev. J Mat. Sci. 2018, Volume 6
DOI: 10.4172/2321-6212-C3-021