Research & Reviews | Journal of Engineering and Technology | Open

ISSN: 2319-9873

Upcoming Special Issues

Invitation


Purpose: To publish the most exciting research with respect to the subjects of Research & Reviews: Journal of Engineering and Technology and to provide a rapid turn-around time regarding reviewing and publishing, and to disseminate the articles freely for research, teaching and reference purposes.

Special Issue Topics
Special issue entitled: "Advancements in Solid Mechanics" is being edited by
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Biography :
 Biography
Liu Zhuangjian
Senior Scientist
Institute of High Performance Computing
Connexis
SINGAPORE
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Special issue entitled: "Scope of Composite Materials" is being edited by
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Biography :
 Biography
Mehdi Hojjati
Associate Professor
Deptartment of Mechanical and Industrial Engineering
Concordia University
Quebec
CANADA
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Special issue entitled: "Trends in engineering and technological development:Some recent advances" is being edited by
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Biography :

Since 2004, 90 papers were published on international reviewed journals (Scientific Reports, Phys. Rev. Lett., Appl. Phys. Lett., Phys. Rev. B, Adv. Mater., Chem. Mater., ACS Nano, J. Phys. Chem B&C, Nanotechnology, et al.), 5 invited review papers were published as book chapters and 4 patents were filed. The total SCI citation is ~ 2400. His present h-index is 24.

 Biography
Dr. Hui pan Faculty of Science and Technology, University of Macau, Macao SAR;                                           ISSUE RELEASED University logo
Submission Process
Submit Special Issue articles online through manuscript submission, review and editorial tracking system for quality and quick review processing at # or send as an e-mail attachment to the editorial office at engtechnol@rroij.com
A manuscript number will be e-mailed to the corresponding author on same day or within 72 hours.
Note:
  1. In case of online submission, please select "Special Issue Article" from the dropdown list.
  2. In case of e-mail, please specify the title of the special issue in the subject and in the cover letter of the submission.
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